12 young people started their careers with a welcome day on 01.09.2017. In addition to two process mechanics, two metal technology specialists, five tool mechanics, one technical product designer and two industrial clerks, we are also delighted to welcome two dual university students for the Mechanical Engineering and International Business courses at the beginning of October this year. There are currently 31 trainees at POLYRACK TECH-GROUP . The five training managers will do their best to ensure that the young people quickly find their feet in their respective areas of work and network well with their fellow trainees and colleagues. We attach great importance to training our own specialists. In a family-oriented company, our trainees learn everything they need for their future careers.

The modular open frame test and development platform can be used in VME/64x and VPX based embedded applications. The development system in rugged aluminum design can accommodate 3U backplanes with up to 10 slots in 1.0 as well as 0.8 inch pitch. The platform supports any combination of front and rear convection or conduction cooled 3U boards.

The system allows application engineers and system developers to access the plug-in cards and backplane from all sides. Efficient cooling is provided by four high-performance fans, each with 120 CFM, which are mounted under the card cage. The black powder-coated Case has an IEC mains input module with filter, mains switch and fuses at the rear. A separate earthing connection is also provided. A modular power supply concept with a wide power spectrum rounds off this platform.

Optionally, additional side plates and the cover plate can be mounted to meet EMC requirements.

The platform also offers RTM (rear transmission module) support.

POLYRACK TECH-GROUP will be presenting itself at Railtex 2017, the 13th international trade show for railroad equipment, systems and services, from May 9 to 11 in Birmingham as a cross-technology partner for standard and customized Case and system solutions for a wide range of markets.

We are looking forward to your visit at booth A69!

We were very pleased to welcome you at our booth and to present you our novelties.

embedded world in Nuremberg impressively underpins its role as the leading international trade show.

With its 15th edition, embedded world once again impressively confirms that it is THE international meeting place for the embedded systems technology industry. In 2017, it once again made significant gains in the key trade fair-relevant figures and ended with new records after three exciting and intensive trade show and congress days: Over 30,000* trade visitors - the international share has risen to 38% - came to Nuremberg, and with more than 1,000 exhibitors (+8%) from 40 countries, the event set a new highlight.

Case and system solutions for demanding markets Straubenhardt, December 20, 2016 - POLYRACK TECH-GROUP will be presenting itself at embedded world 2017 (March 14-16, 2017 in Nuremberg) in Hall 3A, Stand 338 as a cross-technology partner for standard and customer-specific Case and system solutions for many markets.

Designed for harsh environments, the Rugged MIL ½ Short ATR Chassis is a heavy-duty enclosure platform. Available as a salt-brazed aluminum construction and as a sheet metal bending solution according to ARINC 404A, it protects electronic components from mechanical, climatic, chemical and electrical influences. With backplanes according to VITA (VMEbus, VME64x, VPX, OpenVPX) or PICMG standard (CPCI, CPCI Serial, CPCI Plus I/O), power supplies and I/O connection cards, the ATR chassis can be configured to form a complete system. The modular VPX 19" development chassis for use in VME/64x and VPX based embedded applications allows access from all sides for convenient testing and debugging. The rugged aluminum construction accommodates three U backplanes with up to ten slots in 1.0 and 0.8 inch pitch. It also meets high mechanical requirements, e.g. in aerospace, railroad, marine and industrial applications

Cross-technology partner for Case and system solutions

Straubenhardt, September 8, 2016 - POLYRACK TECHGROUP will be presenting itself at electronica 2016 (November 8-11 in Munich) in Hall B1, Stand 441 as a cross-technology partner for standard and customer-specific Case and system solutions for a wide range of markets.

Representative product developments with various solutions and materials demonstrate the POLYRACK TECH-GROUP 's breadth and depth of expertise in mechanics, plastics technology, surface treatment, electronics, assembly and mounting. POLYRACK supports its customers from process development through product and system development to technology and material consulting. The solutions range from small to large components for automation, automotive (ISO&TS 16949 certification), railroad, transportation and traffic engineering, aerospace technology (ISO 9100 certification in implementation), broadcasting, medical technology and mechanical and plant engineering. A novelty at the stand is the presentation of the VPX 19" Development Chassis with a housing concept especially for rugged systems with high mechanical requirements, e.g. in aviation, rail, shipping and industry. The backplane portfolio will also be presented with the "VPX" and "CompactPCI serial" standards.
The PanelPC 2 series is also suitable for industrial applications and is designed for the temperature range from -20°C to +85°C. The Case is available in "milled aluminum" and as a sheet metal bending solution from 10.1" to 21.5" and up to protection class IP54 (IP68 in preparation). The multi-touch-capable PCAP touchscreen is optionally available with tempered glass and anti-fingerprint coating.