News around POLYRACK

POLYRACK presents Case and system solutions for demanding applications

Straubenhardt, October 5, 2017 - POLYRACK TECH-GROUP offers high-quality system solutions with the economic benefits of series production and will be presenting HMI/MMI applications at SPS IPC Drives from November 28-30, 2017 (Hall 5, Stand 171). ‍

For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. These panel PC solutions of protection class IP54 are available in sizes from 10.1'' to 21.5'' as well as in different material variants from milled aluminum to sheet metal bending solutions. Resistive single-touch or multi-touch capable capacitive touchscreens (PCAP) in different glass thicknesses are available as user interfaces. Custom printing and anti-fingerprint coatings are available upon request. ‍

Small Form Factor with EmbedTEC: The aluminum desktopdesktop case is the elegant packaging for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5"), SMARC, QSeven and SBCs such as the Raspberry Pi. It has a replaceable I/O shield and a solid aluminum lid for heat dissipation. For higher performance, this can be replaced by a heat sink, while perforated side panels and fans further increase the cooling capacity if required. POLYRACK also offers a wide range of customizations and mounting options for automation and IoT applications.

Other enclosure series such as SmarTEC for high-quality systems such as passively cooled mini PCs, EmbedTEC for embedded computing and HMI applications, and backplanes for the high-speed sector with the VPX and CompactPCI Serial standards complete the portfolio of the enclosure specialist POLYRACK. All solutions are characterized by the perfect interplay of mechanics, plastics technology and electronics - precisely tailored to the target market.

The POLYRACK TECH-GROUP will be presenting itself at SPS 2017, Europe's leading trade fair for electrical automation, from November 28 to 30 in Nuremberg as a cross-technology partner for standard and customer-specific Case and system solutions for a wide range of markets. We look forward to seeing you in hall 5 at stand 171!

12 young people started their careers with a welcome day on 01.09.2017. In addition to two process mechanics, two metal technology specialists, five tool mechanics, one technical product designer and two industrial clerks, we are also delighted to welcome two dual university students for the Mechanical Engineering and International Business courses at the beginning of October this year. There are currently 31 trainees at POLYRACK TECH-GROUP . The five training managers will do their best to ensure that the young people quickly find their feet in their respective areas of work and network well with their fellow trainees and colleagues. We attach great importance to training our own specialists. In a family-oriented company, our trainees learn everything they need for their future careers.

The modular open frame test and development platform can be used in VME/64x and VPX based embedded applications. The development system in rugged aluminum design can accommodate 3U backplanes with up to 10 slots in 1.0 as well as 0.8 inch pitch. The platform supports any combination of front and rear convection or conduction cooled 3U boards.

The system allows application engineers and system developers to access the plug-in cards and backplane from all sides. Efficient cooling is provided by four high-performance fans, each with 120 CFM, which are mounted under the card cage. The black powder-coated Case has an IEC mains input module with filter, mains switch and fuses at the rear. A separate earthing connection is also provided. A modular power supply concept with a wide power spectrum rounds off this platform.

Optionally, additional side plates and the cover plate can be mounted to meet EMC requirements.

The platform also offers RTM (rear transmission module) support.

POLYRACK TECH-GROUP will be presenting itself at Railtex 2017, the 13th international trade show for railroad equipment, systems and services, from May 9 to 11 in Birmingham as a cross-technology partner for standard and customized Case and system solutions for a wide range of markets.

We are looking forward to your visit at booth A69!

We were very pleased to welcome you at our booth and to present you our novelties.

embedded world in Nuremberg impressively underpins its role as the leading international trade show.

With its 15th edition, embedded world once again impressively confirms that it is THE international meeting place for the embedded systems technology industry. In 2017, it once again made significant gains in the key trade fair-relevant figures and ended with new records after three exciting and intensive trade show and congress days: Over 30,000* trade visitors - the international share has risen to 38% - came to Nuremberg, and with more than 1,000 exhibitors (+8%) from 40 countries, the event set a new highlight.