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ROBUST OPENVPX DEVELOPMENT CHASSIS

The modular open frame test and development platform can be used in VME/64x and VPX based embedded applications. The development system in rugged aluminum design can accommodate 3U backplanes with up to 10 slots in 1.0 as well as 0.8 inch pitch. The platform supports any combination of front and rear convection or conduction cooled 3U boards.

The system allows application engineers and system developers to access the plug-in cards and backplane from all sides. Efficient cooling is provided by four high-performance fans, each with 120 CFM, which are mounted under the card cage. The black powder-coated Case has an IEC mains input module with filter, mains switch and fuses at the rear. A separate earthing connection is also provided. A modular power supply concept with a wide power spectrum rounds off this platform.

Optionally, additional side plates and the cover plate can be mounted to meet EMC requirements.

The platform also offers RTM (rear transmission module) support.

 

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ROBUST OPENVPX DEVELOPMENT CHASSIS

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Nouveautés

ROBUST OPENVPX DEVELOPMENT CHASSIS

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POLYRACK World

POLYRACK TECH-GROUP AT RAILTEX BIRMINGHAM

POLYRACK TECH-GROUP will be presenting itself at Railtex 2017, the 13th international trade show for railroad equipment, systems and services, from May 9 to 11 in Birmingham as a cross-technology partner for standard and customized Case and system solutions for a wide range of markets.

We are looking forward to your visit at booth A69!

 

POLYRACK World

POLYRACK TECH-GROUP AT RAILTEX BIRMINGHAM

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Polyrack Monde

POLYRACK TECH-GROUP AT RAILTEX BIRMINGHAM

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1 Apr
6 Mar
2017
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News

EMBEDDED WORLD 2017 - THANK YOU FOR YOUR VISIT!

We were very pleased to welcome you at our booth and to present you our novelties.

embedded world in Nuremberg impressively underpins its role as the leading international trade show.

With its 15th edition, embedded world once again impressively confirms that it is THE international meeting place for the embedded systems technology industry. In 2017, it once again made significant gains in the key trade fair-relevant figures and ended with new records after three exciting and intensive trade show and congress days: Over 30,000* trade visitors - the international share has risen to 38% - came to Nuremberg, and with more than 1,000 exhibitors (+8%) from 40 countries, the event set a new highlight.

 

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EMBEDDED WORLD 2017 - THANK YOU FOR YOUR VISIT!

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Nouveautés

EMBEDDED WORLD 2017 - THANK YOU FOR YOUR VISIT!

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22 Mar
6 Mar
2017
2024
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Polyrack Tech-Group
6 Mar
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Press

embedded world 2017: POLYRACK TECH-GROUP in Hall 3A, Stand 338

Case and system solutions for demanding markets Straubenhardt, December 20, 2016 - POLYRACK TECH-GROUP will be presenting itself at embedded world 2017 (March 14-16, 2017 in Nuremberg) in Hall 3A, Stand 338 as a cross-technology partner for standard and customer-specific Case and system solutions for many markets.

Designed for harsh environments, the Rugged MIL ½ Short ATR Chassis is a heavy-duty enclosure platform. Available as a salt-brazed aluminum construction and as a sheet metal bending solution according to ARINC 404A, it protects electronic components from mechanical, climatic, chemical and electrical influences. With backplanes according to VITA (VMEbus, VME64x, VPX, OpenVPX) or PICMG standard (CPCI, CPCI Serial, CPCI Plus I/O), power supplies and I/O connection cards, the ATR chassis can be configured to form a complete system. The modular VPX 19" development chassis for use in VME/64x and VPX based embedded applications allows access from all sides for convenient testing and debugging. The rugged aluminum construction accommodates three U backplanes with up to ten slots in 1.0 and 0.8 inch pitch. It also meets high mechanical requirements, e.g. in aerospace, railroad, marine and industrial applications

 

Press

embedded world 2017: POLYRACK TECH-GROUP in Hall 3A, Stand 338

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Press

embedded world 2017: POLYRACK TECH-GROUP in Hall 3A, Stand 338

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1 Dec
6 Mar
2016
2024
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6 Mar
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Press

electronica 2016: POLYRACK TECH-GROUP in hall B1, stand 441

Cross-technology partner for Case and system solutions

Straubenhardt, September 8, 2016 - POLYRACK TECHGROUP will be presenting itself at electronica 2016 (November 8-11 in Munich) in Hall B1, Stand 441 as a cross-technology partner for standard and customer-specific Case and system solutions for a wide range of markets.

Representative product developments with various solutions and materials demonstrate the POLYRACK TECH-GROUP 's breadth and depth of expertise in mechanics, plastics technology, surface treatment, electronics, assembly and mounting. POLYRACK supports its customers from process development through product and system development to technology and material consulting. The solutions range from small to large components for automation, automotive (ISO&TS 16949 certification), railroad, transportation and traffic engineering, aerospace technology (ISO 9100 certification in implementation), broadcasting, medical technology and mechanical and plant engineering. A novelty at the stand is the presentation of the VPX 19" Development Chassis with a housing concept especially for rugged systems with high mechanical requirements, e.g. in aviation, rail, shipping and industry. The backplane portfolio will also be presented with the "VPX" and "CompactPCI serial" standards.
The PanelPC 2 series is also suitable for industrial applications and is designed for the temperature range from -20°C to +85°C. The Case is available in "milled aluminum" and as a sheet metal bending solution from 10.1" to 21.5" and up to protection class IP54 (IP68 in preparation). The multi-touch-capable PCAP touchscreen is optionally available with tempered glass and anti-fingerprint coating.

Press

electronica 2016: POLYRACK TECH-GROUP in hall B1, stand 441

Cross technological partner for enclosure and system solutions

Straubenhardt (Germany), September 19, 2016 - The POLYRACK TECH-GROUP will be presenting itself as a cross-technological partner for standard and customized enclosures and system solutions for a wide variety of markets at the electronica 2016 (November 8-11 in Munich) in hall B1, booth 441.
The wide range of expertise of the POLYRACK TECH-GROUP in mechanics, plastics technology, surface treatment, electronics and assembly is represented through different solutions and demonstrated in a mix of materials. POLYRACK supports their customers starting with the process development through the design of products and systems including consultation for the most efficient technologies and materials. Solutions range from various sizes for applications in automation, automotive engineering (certificate in accordance to ISO/TS 16949), railway, transportation and traffic technology, aerospace technology (certificate in accordance to ISO 9100 in process), broadcasting, medical technology as well as test, measurement and control technology.POLYRACK will introduce its new VPX 19'' Development Chassis. The chassis is designed as concept platform for rugged systems trial purposes such as aviation, railway, naval applications and the industry. The standard backplane-portfolio will be completed with the display of "VPX" and "CompactPCI serial".The PanelPC 2 Series from POLYRACK complements several applications in numerous variations. The PanelPC 2 is designed for rough conditions in industrial environments furnished with a capacitive touch screen and suitable for extended options. POLYRACK has dedicated his PanelPC 2 series specifically for HMI/MMI industrial applications. The products withstand enhanced temperature ranges of -20°C up to +85°C and sustain to a maximum of shock and vibration. The enclosure is reliably protected against dust and water rated up to IP65. The multi-touch capable PCAP touchscreen is available optionally with toughened glasses and anti-fingerprint-coating.

Press

electronica 2016: POLYRACK TECH-GROUP in hall B1, stand 441

Cross technological partner for enclosure and system solutions

Straubenhardt (Germany), September 19, 2016 - The POLYRACK TECH-GROUP will be presenting itself as a cross-technological partner for standard and customized enclosures and system solutions for a wide variety of markets at the electronica 2016 (November 8-11 in Munich) in hall B1, booth 441.
The wide range of expertise of the POLYRACK TECH-GROUP in mechanics, plastics technology, surface treatment, electronics and assembly is represented through different solutions and demonstrated in a mix of materials. POLYRACK supports their customers starting with the process development through the design of products and systems including consultation for the most efficient technologies and materials. Solutions range from various sizes for applications in automation, automotive engineering (certificate in accordance to ISO/TS 16949), railway, transportation and traffic technology, aerospace technology (certificate in accordance to ISO 9100 in process), broadcasting, medical technology as well as test, measurement and control technology.POLYRACK will introduce its new VPX 19'' Development Chassis. The chassis is designed as concept platform for rugged systems trial purposes such as aviation, railway, naval applications and the industry. The standard backplane-portfolio will be completed with the display of "VPX" and "CompactPCI serial".The PanelPC 2 Series from POLYRACK complements several applications in numerous variations. The PanelPC 2 is designed for rough conditions in industrial environments furnished with a capacitive touch screen and suitable for extended options. POLYRACK has dedicated his PanelPC 2 series specifically for HMI/MMI industrial applications. The products withstand enhanced temperature ranges of -20°C up to +85°C and sustain to a maximum of shock and vibration. The enclosure is reliably protected against dust and water rated up to IP65. The multi-touch capable PCAP touchscreen is available optionally with toughened glasses and anti-fingerprint-coating.

1 Sep
6 Mar
2016
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Press

InnoTrans 2016: POLYRACK TECH-GROUP in Hall 2.1, Stand 413

19'' subracks Future from POLYRACK withstand heavy mechanical stress.

Straubenhardt, 3 August 2016 - The robust Future subrack series from POLYRACK TECH-GROUP can be customized. It is designed for different shielding concepts and areas of application in harsh environments such as railroad technology.

POLYRACK has developed its Future subracks to be particularly robust for applications in demanding environments. Thanks to the double bolting of the stable profiles as well as the toxed version of the side walls, the Future series meets the requirements for a "vibration-resistant" product and thus qualifies for use by Deutsche Bahn (according to LES-DB) as well as the French railroad system (NF-F).

Depending on the requirements profile, a wide variety of configurations can be put together with the standard parts of the Future series. The basic structures differ in vibration resistance and shielding concept: In the "EMC spring" shielding concept, the corner brackets have a groove for clipping in spring elements; in the "EMC seal" concept, they have a leg for gluing in a CuNi coated fabric. POLYRACK also offers an IEEE 1101.1/IEEE 1101.10 compatible version with front profiles and grid perforation. Combinations of form-fitted and double-bolted side panel corner brackets and side panel end panels ensure a robust structure. Thanks to the profile positioning in 10mm increments, dual expansion is also possible.

Further variants can be individually assembled using the individual parts. An example of a customized design is a subrack based on the Future series, which POLYRACK successfully had certified according to EN 60068. With its weight of 10 kg, it can withstand shock loads of up to 5G, making it suitable for use in environments with heavy mechanical stress, such as in railroad cars, power plant construction, mines or trucks. In addition to development and customization up to the finished product, POLYRACK also takes care of certification of the developers with accredited partners, such as TÜV Rheinland.

Press

InnoTrans 2016: POLYRACK TECH-GROUP in Hall 2.1, Stand 413

19'' subracks Future from POLYRACK withstand strong mechanical impact

Straubenhardt (Germany), August 3, 2016 - The robust subracks series Future from POLYRACK TECH-GROUP can be individually configured. It is designed for different shielding concepts and applications in harsh environments such as railway technologyFor
applications in demanding environments, POLYRACK developed its Future subracks exceptionally robust. Thanks to the securing of the heavy-duty rails with two screws each side as well as the toxjoined version of the side plates, the Future series meets the requirements on a "vibration resistant" product and therefore corresponds for use at the Deutsche Bahn (according to LES-DB) as well as the French railway system (NF-F).Depending on the demands, various configurations can be combined with the standard parts of the Future series. The basic constructions are differing in vibration resistance and shielding concept: The shielding concept "spring" carries a groove for insertion in the mounting bracket while the concept "gasket" shows a detail for a self-adhesive strip in a CuNi coated fabric. POLYRACK also has a compatible version according to IEEE 1101.1/IEEE 1101.10 with front extrusions and ejector handle perforation in its product range. Combinations of positively tox-joined and with two screws secured side plate mounting brackets and side plate corner brackets ensure a robust construction. Due to the profile positioning in 10mm increments a dual construction is also possible.Further versions can be individually configured by single components. An example for a customer-specific solution is a subrack based on the Future series that was successfully certified according to EN 60068 by POLYRACK. With its weight of 10kg, it withstands shock loads up to 5G and is suitable for use in environments with strong mechanical load, such as in rail wagons, power plants, mines or lorries. Besides the development and customer-specific adaptations up to the complete product solution, POLYRACK also provides the certification of the subracks with accredited partners, e.g. the TÜV Rheinland.

Press

InnoTrans 2016: POLYRACK TECH-GROUP in Hall 2.1, Stand 413

Les bacs à cartes 19'' " Future " de POLYRACK sont conçus pour des environnements mécaniques sévères

Straubenhardt (Allemagne), 3 août 2016 - La série de bacs à cartes " Future " de POLYRACK TECH-GROUP, se base sur une conception robust et permet une configuration individuelle en fonction des applications et demandes. Prévues avec plusieurs solutions de blindage les bacs à cartes peuvent être utilisés dans des environnements sévères et notamment dans le domaine ferroviaire.
POLYRACK conçu ses bacs à cartes Future particulièrement robuste pour être utilisés dans desenvironnements très exigeants. Thanks to the double sealing of the profiles and the rigid version of the latéraux flanks, the "Future" series follows the rules of a design intended to withstand chocks. Thus, this product is qualified to be put into service on the German railroads (according to LES-DB) as well as on the French railway market (NF-F). Depending on the applications and requirements, several configurations can be realized by using standard parts from the "Future" series. The base versions are distinguished by their resistance to chocks and blind concepts. In the case of blind assembly by CEM ressort, the rackage crossbar includes a rainure for enclosing the ressorts. In the case of blind assembly by CEM textile joint, the rack includes in its section of the profile a retour for coller un tissu revêtu de CuNi. POLYRACK also offers a variant with profilés avant à lèvres rallongées IEEE 1101.1/IEEE 1101.10. En réalisant le sertissage des flancs latéraux avec les équerres de rackages tout en utilisant les profilés fixés par double vissage, cette configuration robuste répond à des utilisations à fortes contraintes de chocs et vibrations. The positioning of the profiles at a distance of 10 mm also allows a "DUAL" assembly to be realized. Other configurations can be realized by selecting the customized components. For example, on the basis of a personalized design, the "Future" series of cartridges has been successfully certified in accordance with EN 60068. Tested with the integration of a mass of 10 kg, it satisfies the tests for chocs up to 5G and therefore meets the requirements for certain high-demand applications such as use in railway wagons, power stations, mines and transportation. In addition to personalized development and adaptation right up to the finished product, POLYRACK also offers certification of cardboard boxes with accredited partners such as the TÜV Rheinland Technical Inspection Centre.

1 Aug
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2016
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