Bonding Technology & Seals

Applicable dosing materials are all commercially available materials on 1 K basis from low viscosity to filled, with abrasive materials, such as UV adhesives and sealants, silicones, MS polymers, PUR, silicones with particles (EMC). 

In the field of sealing technology, so-called compact materials with a hardness of 16 - 60 Shore A are available. These materials are not compressible in themselves and require space for lateral expansion after the joining process.

Bonding is the joining process of the future. With the volumetric dosing machines, a wide variety of adhesives such as epoxy resins, acrylates, PUR, silicones etc. can be applied reproducibly and process-securely in the most diverse forms.

We would be pleased to advise you on the implementation of your applications.