POLYRACK at embedded world 2020: Case and system applications for the products of tomorrow
Straubenhardt (Germany), December 12th, 2019 – The POLYRACK TECH-GROUP will be presenting their wide range of case and system solutions from February 25th to 27th 2020 at the embedded world in Nuremberg (Hall 3, Booth 445). In addition to a large number of case systems, particularly customer-specific system applications from various branches and application fields including integration of electronics and a range of HMI and MMI applications will be displayed.
For the embedded sector, especially for industrial environments, POLYRACK presents the PanelPC 2 series. With protection class IP54, it is available in sizes from 10.1'' to 21.5'' and in various material variants. Resistive single-touch or multi-touch capable capacitive touch screens (PCAP) in several glass thicknesses are available as user interfaces. Customized painting and anti-fingerprint coatings are available on request. In addition, other materials are available to customers for the realization of individual requirements, e.g. plastic and cast iron - also in material combinations.
Small Form Factor with EmbedTEC: The aluminium desktop case is the elegant design for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5“), SMARC, QSeven and SBCs as well as the Raspberry Pi. It comes with a changeable front I/OShield as well as a massive aluminium cover for the heat dissipation. The cover might as well be replaced by a heat sink for improved performance. Alternatively, perforated side panels or small fans can add to the cooling performance on top. POLYRACK also offers various adaptations and mounting options for applications in the fields of automatization and IoT.
The elegant 19“ Compact PCI system MPS03 which is available in different sizes (e.g. 1U, slots) is ideally suited for applications in the field of communications technology. POLYRACK will also be showing the RAILO wall-mounting module, which accommodates PCBs, Eurocards or custom electronics with a height of 122 mm. Further case series like the SmarTEC for systems as the passive cooled Mini PCs, EmbedTEC for embedded computing and HMI applications as well as Backplanes for the High-Speed-Area with Standard VPX and CompactPCI Serial complete the portfolio of POLYRACK.
All solutions are characterized by the appropriate interaction of mechanics, plastics, electronics and the surface finish - tailored to the requirements of the customer application.
You can read the complete press release here!