// Lexicon
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
If the term you are looking for is not contained in this list, you may find it on Wikipedia.
A ^
ABS
Abbreviation for acrylonitrile butadiene styrene.
AC
Abbreviation for ‘Alternating Current’.
ADC
Automatic (electronic) Daisy Chaining
ANSI
Abbreviation for “American National Standards Institute” (the equivalent of the German DIN). The ANSI is the American organization responsible for standardization, e.g. the codification of fonts for computers.
AT
Abbreviation for ‘Advanced Technology’. AT corresponds to a particular generation of circuit boards for personal computers. These are generally characterized by the 80286 processors from the Intel Corporation or by the 16-bit ISA extension bus. The ISA-Bus is also referred to as the AT-Bus for this reason.
ATX
ATX refers to a specific Intel mainboard layout. The ATX boards are characterized by short cables to the hard drive which allows for higher transfer rates, better ventilation of the CPU and the possibility of an automatic start of the computer.
C ^
CompactPCI
Abbreviation for “Compact Peripheral Component Interconnect Bus”. Compact PCI is a registered Trademark of the PCI Industrial Computer Manufacturers Group (PICMG). CompactPCI Systems are standardized microcomputers. The main advantage of CompactPCI lies in its Hot Swap capabilities.
D ^
Daisy Chain
A daisy chain is a group of hardware components that are connected in series. The first component is connected directly to the computer, and all other components are linked to each other in a chain.
Daisy Chaining
The connected components in a daisy chain can be allocated different priorities for the exchange of data, which is meant to prevent conflicts and malfunctions. The daisy chaining of a circuit board can be done either mechanically or electronically.
DC
Abbreviation for “direct current”: current of the same strength and direction
DIN
Abbreviation for “Deutsches Institut für Normung” (German Institute for Standardization): comparable to the American ANSI.
DIN 41494
DIN 41494 is the basic specification for the 19” construction systems. It is separated into different parts and defines the measurements for the individual components.
DIN 41612
DIN 41612 is the basic standard to printed circuit connectors. It defines the design and construction characteristics for connectors.
DIN 41617
DIN 41617 is the basic standard to printed circuit connectors. It defines the design and construction characteristics for connectors.
Double euroboard
The double euroboard is a circuit board according to a DIN standard. The card measures 233,35 x 160 mm. The reference "double euroboard" means that two cards can be inserted into the space one above the other.
E ^
EMC
Electromagnetic compatibility is the ability of an electrical device to function satisfactorily in its electromagnetic environment without affecting this environment and other devices that may be present in it.
Three European standards define the basis for electromagnetic compatibility.
The EN 50081 deals with emitted interference in residential, commercial, industrial and small business areas.
The EN 50081 deals with the interference immunity in the same areas.
The standard 550222 defines the limit values and measuring methods for radio interference for information technology devices.
EN
Abbreviation for "European Norm"
EN 55022
European specification defining standards for information technology equipment and essentially covers the topics of radio interference as well as defining limits and measuring methods.
EN 60950
European specification defining the security of equipment for information technology.
ESD
1. Abbreviation for “Electrostatic Discharge”. This is the process of charge equalization between solid, liquid or gaseous media that have different electrostatic charges. The charge equalization is usually accompanied by a spark or other sign of discharge.
2. Abbreviation for “Electrostatic Sensitive Devices”
ETSI
Abbreviation for "European Telecommunications Standards Institute“. Members of the ETSI include parts of the EU administration, European manufacturers and development institutes. ETSI Standards are referred to as ETS (European Telecommunication Standards).
Euroboard
The euroboard is a circuit board according to a DIN standard. The card measures 100 x 160 mm.
H ^
HP
Abbreviation for "Horizontal Pitch" or standard width measurement which defines the width for plug-in modules in the 19” construction system. One HP equals 5.08 mm.
Hot Swap
Hot Swap
Refers to the exchange of computer components while the computer is running. There are three defined stages:
1. Basic hot swap: the component that is going to be changed has to be deactivated or the computer configuration has to be changed first.
2. Full hot swap: software in the component to be changed or in another component takes care of the activation or deactivation automatically.
3. High availability model: a separate hot swap controller takes control. This allows for failed boards to be deactivated automatically and therefore prevents the computer from crashing.
Heatsink
Heatsinks allow excessive heat that is given off by components to be dissipated into the environment through an enlargement of the surface.
I ^
IEC
Abbreviation for “International Commission for Electrical Engineering”.
The IEC is an international organization based in Geneva, Switzerland, which is comprised of all national electrical engineering committees. It develops and adopts electrical engineering standards at a global level.
IEC297
A publication of the IEC (International Commission for Electrical Engineering) for 19” construction systems. It provides the original standard for the 19” construction system and was the basis for the DIN 41494.
IEC 821
The IEC 821 refers to the specification for the VMEbus. An IEC is a standard from the International Organization for Standardization (ISO).
IEEE
Abbreviation for “Institute of Electrical and Electronics Engineers Inc.” The IEEE is a non-profit organization with over 377,000 members worldwide which encourages and standardizes technical developments.
IEEE 1101.10
IEEE 1101.10 is a standard for the additional mechanized specifications for microcomputer systems. This specification applies to all microcomputer applications that must conform to the 19” standard.
IEEE 1014
The IEEE 1014 refers to the Specification for the VMEbus.
IN-Board-Termination
The termination is positioned between the first and second and the next-to-last and last expansion slots on the backplane. This has the advantage of not affecting the outer dimensions of the backplane.
IP
Abbreviation for International Protection.
IP protection class defines the protection of electrical devices against contact, foreign bodies, or moisture. Cases and covers must be designed so as to meet the IP protection class requirements.
The IP Protection Class is defined by an identification number. The definitions and explanations for the IP identification numbers are given in the specifications DIN VDE 0470 Part 1, EN60529 and IEC 529.
ISA
Abbreviation for “Industry Standard Architecture” This refers to a bus that was developed by IBM and is still used today on almost all main boards due to its compatibility.
ISO
Abbreviation for "International Organization for Standardization". An international board which covers all standards.
M ^
MDC
Manual Daisy chaining with jumpers for VMEbus.
MPS
Abbreviation for Microcomputer Packaging System. Microcomputers for industrial use with VMEbus, VME, VME64x, CompactPCI and Industrial PC applications are set up predominantly according to an MPS.
N ^
Nema
Abbreviation for "National Electrical Manufacturers Association"
O ^
ON-Board-Termination
The termination is positioned before the first and after the last expansion slot on the backplane, which increases the outer dimensions of the backplane by approximately 2 U on both the right and left sides.
Open Frame
This term is used in reference to power supply units. So-called “Open Frame power supplies” don’t have a cover which means that the electronic components in the power supply are easily accessible.
P ^
PA6
Abbreviation for polyamide.
PC
Abbreviation for polycarbonate.
PCI
Abbreviation for "Programmable communication interface": This is a means for the serial data transfer which can be directly connected to the computer. It changes a parallel data value into serial data and transmits it. In can also receive serial data and change in into parallel data. The data transmission can be synchronous or asynchronous.
PE
Abbreviation for polyethylene.
PFC
Abbreviation for Power Factor Correction. The Power Factor defines the relationship between the active power and apparent power for an electrical appliance. The higher the power factor for any given appliance, the higher its effectiveness.
The power factor correction serves to increase the effectiveness of an electrical appliance. This is achieved through the reduction of heat loss, reduction of high frequency EMC-interference as well as through an improvement of the mains voltage distribution process.
PICMG
PICMG refers to the Abbreviation for PCI Industrial Computer Manufacturers Group. The PICMG is a consortium of more than 600 companies that develop specifications for high end telecommunications and industrial computer applications in close cooperation. The PICMG specifications include the CompactPCI for euroboard formats, among others.
P0
The P0 is an additional I/O connection that can be freely allocated and is used in VME64x-backplanes. It is placed between the J1 and J2 levels. A PCI-Bus or Network bus can be connected to the P0 (compare to the VME64x specification ANSI/VITA 1.1-1994 thru 1.1-1997)
PP
Abbreviation for polypropylene.
PS
Abbreviation for polystyrene.
PUR
Abbreviation for polyurethane.
PVC
Abbreviation for polyvinyl chloride.
R ^
Rack System 19"
The 19” rack system is made up of different mechanical and electromechanical parts which can be combined to form electronic appliances and equipment in a modular construction. The measurements of 19” rack systems are laid out in DIN specifications as well as in IEC publications.
Rear I/O
The term Rear I/O deals with bus circuit boards. Rear I/O are pins on the back of bus circuit boards which can be freely allocated so that the user can attach his expansion cards as needed.
RFI
Abbreviation for "Radio Frequency Interference". This exists beyond a frequency of approx. 100kHz.
S ^
SMD
Abbreviation for “surface mounted device”. These are electronic components that don’t have connection wires but are instead placed directly on the surface of an electronic circuit board and attached with solder.
SMT
Abbreviation for “surface mounted technology”
T ^
Termination
Termination is a particular end of a cable on a bus circuit board.
U ^
UL
Abbreviation for “Underwriters’ Laboratory”. The UL is an independent organization which conducts safety tests and product certifications.
UL94
Abbreviation for “Underwriters’ Laboratory”. UL94 is a test from the Underwriters’ Laboratory to investigate the flammability of plastics. The test involves setting fire to a material sample of a certain size hung vertically and measuring the time necessary before the fire extinguishes itself.
U
Abbreviation for "Unit" or standard height measurement which defines the vertical height for plug-in modules in the 19” construction system. One U equals 44.5 mm.
V ^
VDE
Abbreviation for "Verband Deutscher Elektrotechniker e.V" (Association for Electrical, Electronic & Information Technologies), based in Frankfurt am Main, Germany.
VITA
Abbreviation for “VMEbus International Trading Association”. The VITA is an non-profit association of manufacturers and users of VMEbus products that works towards the goal of promoting and expanding VMEbus.
VMEbus
The VMEbus is a microcomputer bus system for real-time use. The VMEbus was originally designed by a consortium led by Motorola. Today the VMEbus is defined by the Standard IEEE 1014.